[108] S. Lee, J. Park, J. Hwang, M. Kang, H. Kim, C. Han, H. Ahn, J. Cho, H. Lee

Co-design of Power Electronic Packaging and Cooling Architectures Guided by Thermal Transport Trade-offs (under review)

[107] J. Kim, J. Bae, J. Kim, D. Jung, D. Seo, Y. Jang, P. Sultane, C. Bielawski, H. Lee, J. Oh, J. Cho

High thermal conductivity in ultrathin single-crystalline BeO films (under review)

[106] C. Song, J. Kim, H. Nam, T. Kim, J. Lee, S. Pak, H. Lee, J. Cho*

Enhancing device-level cooling of high-power GaN devices via substrate engineering (in revision)

[105] J. Lee, J. Park, J. Park, K. Yu, H-J. Pyo, K. Kim, H. Lee, H. Lee*

Coupled thermal-electromagnetic performance of slot-integrated vapor chambers in high-speed hairpin motors (under review)

[104] J. Choi, D.M. Huan, C. Ryu, S. Kim, S. Lee, H. Lee, J.B. In*

Enhanced pool boiling performance of porous copper surfaces fabricated by laser-directed energy deposition (submitted)

[103] H. Lee, H. Lee*

Physics-constrained machine learning for enhanced prediction of critical heat flux in pool boiling (under review)

[102] C. Yoon, Y. Kim, C. Han, D. Shin, H. Lee*, S. Lee*

Layer-wise attentive physics-informed learning approach for thermal spreading behavior of heterogeneous multilayer stacks (submitted)

[101] S. Lee, D. Kong, J. Hwang, M. Kang, S. Pak, J. Cho*, H. Lee*

Hierarchical thermo-fluid modeling framework of CuIO-coated manifold microchannels for high-heat-flux electronics cooling (under review)

[100] M. Khalid, H. Lee*, J-S. Kwon*

Passive and AI-assisted enhancement strategies for PCM-based latent heat thermal energy storage using fins, metal foams and hybrid fin–foam structures (submitted)

[99] D. Kim, J. Park, H. Lee, J.Y. Park*

Enhanced thermo-fluid dynamics of solar updraft towers using integrated dual-arc collector geometry (submitted)

[98] C. Suresh, I.I. El-Sharkawy, S. Lee, D. Kong, J. Cho, Y. Jeon*, H. Lee*

Advanced phase change material heat sinks and hybrid cooling solutions for next-generation electronic thermal management (submitted)

[97] D. Lee, H. Lee, J. Lee, N. Miljkovic, S.H. Lee*

Rack-scale thermal-hydraulic modeling and assessment of single-phase liquid cooling for high-density artificial intelligence servers (submitted)

[96] H. Yong, H. Lee, S. Kim, J. Hong, S. Lee

Complex boiling-flow-driven nanogenerator for phase-change thermal monitoring (under review)

[95] M. Kang, J. Park, H.W. Jung, S.I. Kim, S. Lee, I. Choi, J.W. Lim, H. Kim, J. Cho, H.K. Ahn*, H. Lee*

Co-designed device-level cooling for AlGaN/GaN HEMTs enabling high-power RF devices (submitted)

[94] T.M. Quan, H. T. Khieu, S. Lee, Y.M. Lee, H. S. Ryou, S.H. Lee*, H. Lee*

Characterization of smoke propagation during battery electric vehicle fires in underground parking facilities (in print)

[93] H. Kwon, R. Giglio, D. Kong, M. Shattique, H. Lee, J. Palko, E. Dede, M. Asheghi, K.E. Goodson

Exploring capillary limits of copper wire mesh manifold for area scaling of capillary-driven two-phase coolers, International Communications in Heat and Mass Transfer 180 (2026) 112500 (IF 7.0, JCR top 4.7%)

[92] S. Lee, S. Lee, Y. Kim, S. Kang, S.H. Lee, J. Lee*, H. Lee*

Thermodynamically consistent phase-change framework for closed geothermalthermosyphons, Energy (2026) (IF 9.0, JCR top 3.2%)

[91] Y. Kim, C. Yoon, H. Lee, S. Bae, N. Kang, C. Han, D. Shin, J. Cho, S. Lee*, H. Lee*

Physics-informed neural networks for thermal spreading of multilayer multichip power modules, International Communications in Heat and Mass Transfer 180 (2026) 112739 (IF 7.0, JCR top 4.7%)

[90] D. Eom, Y. Lee, D. Oh, H. Lee*, S. Park*

Facile sprayed and electro-activated ultra-low Pt loading catalyst for hydrogen evolution reaction and PEM water electrolysis, Small (IF 12.1, JCR top 7.2%)

[89] S. Lee, S.J. Lee, H. Lim, S. Kang, S.H. Lee, J. Lee, H. Lee

Thermal performance evaluation of phase change in an L-shaped geothermal thermosyphon, Trans. Korean Soc. Mech. Eng. B 50 (3) (2026) 103-111

[88] H. Kwon, R. Giglio, D. Kong, M.R. Shattique, H. Lee, J.W. Palko, E.M. Dede, M. Asheghi, K.E. Goodson*

Capillary-driven two-phase cooler for high-heat-flux electronics using copper wire mesh manifold and enhanced copper inverse opal wick heat sink, Applied Thermal Engineering 303 (2026) 131914 (IF 7.5 JCR top 5.5%)

[87] S. Lee, J.H. Seo, Y. Kim, H. Choi, S.H. Lee, J. Lee*, H. Lee*

Efficient porous-medium framework for compact heat pipe heat exchanger, International Journal of Energy Research (2026) 6962940 (IF 4.2 JCR top 1.2%)

[86] S. Lee, M. Kang, J. Byoun, H. Choi, J. Park, H.W. Jung, S.I. Kim, J.W. Lim, H. Kim, H.K. Ahn, H. Lee

Device-level co-integration of direct liquid cooling in GaN-on-SiC RF HEMTs, Journal of Mechanical Science and Technology 40, 5 (2026) 3963-3974

[85] Y. Lee, D. Eom, S. Park*, H. Lee*

Structured selective activation for bubble-controlled high-rate alkaline OER, Small (IF 12.1, JCR top 7.2%)

[84] S. Kang, T. Kim, M. Jung, J. Pyo, S. Park, S. Park, J. Byeon, H.G. Lee, J.P. Hong, S-T. Lee, M. Kim, H. Lee, S. Cha*, S, Pak*

Room temperature wafer-scale synthesis of highly transparent and conductive p-type sulfur-doped copper iodide, Energy & Environmental Materials (IF 14.1, JCR top 7%)

[83] Y. Kim, D. Kong, B. Jang, T. Kim, H-J. Kwon, J. Cho, J.B. In*, H. Lee*,

Thermally induced structural evolution of diamond surface for pool boiling enhancement, Applied Thermal Engineering 289 (2026) 129919 (IF 6.9, JCR top 4.7%)

[82] Y. Kim, H. Lee*, S. Jeong, N. Kang, C. Han, D. Shin, H. Lee*

Physics-guided genetic algorithm for optimization of multi-jet impingement cooling, Applied Thermal Engineering 289 (2026) 129889 (IF 6.9, JCR top 4.7%)

[81] D. Lee, H.J. Lee, H. Lee, S.H. Lee*

Influence of local perforations on heat transfer enhancement in inclined rib turbulators, International Journal of Heat and Mass Transfer 255 (2026) 127785 (IF 5.8, JCR top 7.9%)

[80] C. Suresh, A. Awsthi, B. Kumar, H. Lee*, Y. Jeon*

Comprehensive review on heat pump systems integrated with phase change material-based thermal energy storage for sustainable building heating, Renewable and Sustainable Energy Reviews 226(2026) 116197 (IF 16.3, JCR top 2.5%)

[79] S. Lee, Y. Kim, J. Seo, D.H. Shin, S.H. Lee, J. Lee, H. Lee

Thermal performance analysis of heat pipe small heat exchanger using porous media modeling, Trans. Korean Soc. Mech. Eng. B 49 (6) (2025) 327-334

[78] Y. Lee#, D. Kong#, J. Hwang, S. Jeong, J. Cho, H. Lee*

Boiling dynamics in microporous copper-coated manifold microchannels, Applied Thermal Engineering 280 (2025) 128353 (IF 6.9, JCR top 4.7%)

[77] D. Kong, H. Kwon, H. Lee, H. Lee, M. Asheghi, K. E. Goodson

Development of a capillary-driven two-phase microcooler using copper wiremesh 3D manifold and silicon micropin fin wicks, International Journal of Mechanical Sciences 305 (2025) 110781 (IF 9.4, JCR top 2.5%)

[76] K. Jiang, D. Kong, S. Narumanchi, J. W. Palko, E. M. Dede, H. Lee, M. Asheghi, K. E. Goodson

Mitigation of boiling-induced thermal degradation using microporous nickel inverse opals (NiIOs) structures, Journal of Electronic Packaging 147 (2025) 041107 (IF 2.3, JCR top 45.7%)

[75] D. Kong, H. Kwon, H. Lee, H. Lee, M. Asheghi, K. E. Goodson

Computational fluid dynamics (CFD) modeling and optimization of large-scale (3cm × 3cm) silicon-based embedded microchannels with 3D manifold micro-coolers, Journal of Electronic Packaging 147 (2025) 041105 (IF 2.3, JCR top 45.7%)

[74] J. Jin, H.J. Lee, H. Lee, C. K. Choi, S. H. Lee*

Tailored control of evaporation flux for uniform coffee-ring patterns in multiple nanofluid droplets, Physics of Fluids 37 (2025) 082133 (IF 4.3, JCR top 6.1%)

[73] M. Kang, H-W, Jung, J. Park, I. Choi, S-J. Chang, S-I. Kim, J-W. Lim, H-K. Ahn, H. Lee

Thermal design and fabrication of embedded liquid cooling for gallium nitride high electron mobility transistor devices, Applied Science and Convergence Technology 34 (1) (2025) 16-20.

[72] J. Park, S-J. Chang, M. Kang, H. Kim, I. Choi, H-W. Jung, S-I Kim, J-W. Lim, H-K. Ahn, H. Lee

Thermal cross-talk analysis in multi-finger gallium nitride high electron mobility transistors, Applied Science and Convergence Technology 34 (1) (2025) 12-15

[71] JH.Lee, C.Lee, H. Lee*,

Physics-informed machine learning for enhanced prediction of condensation heat transfer, Energy and AI 20 (2025) 100482. (IF 9.6, JCR top 6.9%)

[70] Y. Lee, K. Kim, Y. Kim, D. Kong, J. Park, D. Son, S. Kang, S. Hong, H. Lee*,

Micro-/nano hierarchical surfaces for enhanced pool boiling in large-area silicon multichips, Small Structures (2025) 2400512. (IF 13.9, JCR top 6.9%)

[69] S. Lee, S. Kang, Y. Kim, G. Geum, D. Kong, D. W. Shin, S. H. Lee, J. Lee, H. Lee*,

Thermal design framework of heat pipe heat exchanger for efficient waste heat recovery, Energy 318 (2025) 134731 (IF 9.0, JCR top 3.2%)

[68] Y. Kim#, D. Kong#, R. D. Selvakumar, M. Kang, N. Kang, J. Kwon*, H. Lee*,

Thermal-hydraulic characterization in manifold-microchannel heat sinks for energy-efficient cooling of HEV/EV power modules, Applied Thermal Engineering 265 (2025) 125611 (IF 6.1, JCR top 5.2%)

[67] T.D. Mai, D-T. Vo, B. Kim, U. Lee, D. Kim, H. Lee*, J. Ryu*

Impact of trailing-edge modification in stator vanes on heat transfer and the performance of gas turbine: a computational study, Engineering Applications of Computational Fluid Mechanics 18 (2024) 239430 (IF: 6.1, JCR Top: 8.4%)

[66] H. Kim. E. Jung, C. Ryu, H. Lee*, J. B. In*,

Nanosecond laser structuring for enhanced pool boiling performance of SiC surfaces, Applied Surface Science 675 (2024) (IF 6.3, JCR top 10.9%)

[65] S. Cho, D. Kong, G. Geum, S. Lee, J. Park, S.H. Lee, J. Lee*, H. Lee*

Explicitly defined empirical constant for phase change simulation in a two-phase closed thermosyphon, International Communications in Heat Mass Transfer 158 (2024) 107932 (IF 7.0, JCR top 4.7%)

[64] D. Kong, H. Kwon, B. Hang, H-J. Kwon, M. Asheghi, K. E. Goodson, H. Lee*,

Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels, Energy Conversion and Management 315 (2024) 118809 (IF 9.9, JCR top 1.8%)

[63] H. Kwon, Q. Wu, D. Kong, S. Hazra, K. Jiang, S. Narumanchi, H. Lee, H. Palko, E. M. Dede, M. Asheghi, K. E. Goodson*,

Capillary-enhanced two-phase micro-cooler using copper-inverse-opal wick with silicon microchannel manifold for high-heat-flux cooling application, International Communications in Heat and Mass Transfer 156, 107592 (2024) (IF 7.0, JCR Top: 6%)

[62] E. Jung, D. Kong, M. Kang, J-H Kim, J. H. Jeong, J. B. In, K-Y Oh*, H. Lee*

Enhanced immersion cooling using laser-induced graphene for Li-ion battery thermal management, International Communications in Heat Mass Transfer 155 (2024) 107558 (IF 7.0, JCR top 4.7%)

[61] N. Her, S-Y Park, S. Woo. H. Lee*, S. T. Choi*,

Viscoelastic finite element analysis of roll transfer process with rate-dependent adhesion behavior and multi-element cohesive interaction, Journal of Mechanical Science and Technology 38 (2024)

[60] C. Ryu, H. Kim, H. Lee, J. B. In*

Laser-induced selective wettability transition of 6061 aluminum alloy surfaces, Journal of Mechanical Science and Technology 38 (2024) 2143-2150

[59] A.M. Randriambololona, V. Manepalli, R. C. MaAfee, B. Ojha, R. Miraftab-Salo, K. Guye, H. Lee, S. Graham, D. Agonafer

Three-component composite phase change material (PCM) for electronics subject to transient/pulsed heat loads, IEEE Transactions on Components, Packaging and Manufacturing Technology 14 (12) (2024) 2248-2257

[58] H. Lee, G. Lee, K. Kim, H. Lee*,

Multimodal machine learning for predicting heat transfer characteristics in micro-pin fin heat sinks, Case Studies in Thermal Engineering 57 (2024) 104331 (IF 6.8, JCR top 7.1%)

[57] K. Kim, D. Kong, Y. Kim, B. Jang, H. J. Kwon, J. Cho, H. Lee*,

Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap, Applied Thermal Engineering 241 (2024) 122325 (IF 6.4, JCR top 6.2%)

[56] B. Kim, T-D Mai, D-T Vo, H.K. Lee, Y. Jeong, S. Chang, H. Lee*, J. Ryu*,

Hydrogen combustion in 2-stage high-pressure gas turbine – thermal and flow simulations for performance comparison with fossil fuels, International Journal of Engine Research 25 (2024)

[55] M. Kang, D. Kong, J. Park, J. B. In, H. Lee*,

Enhanced wick-based liquid supply in patterned laser-induced graphene on flexible substrates, Journal of Mechanical Science and Technology 37 (2024) 1007-1014.

[54] D. Kong, E. Jung, K. Kim, K. Jiang, Q. Wu, B. Jang, H. J. Kwon, M. Asheghi, K. E. Goodson, H. Lee*

Boiling-induced thermal degradation of copper inverse opals and its mitigation, International Communications in Heat Mass Transfer 151 (2024) 107250 (IF 7.0, JCR top 4.7%)

[53] G. Geum, S. Kang, S. Cho, D. Kong, S. Lee, J-H. Seo, D. H. Shin, S. Lee, J. Lee*, H. Lee*

Thermal performance analysis of heat pipe heat exchanger for effective waste heat recovery, International Communications in Heat Mass Transfer 151 (2024) 107223 (IF 7.0, JCR top 4.7%)

[52] A.A. Arbab, S. Cho, E. Jung, H. S. Han, S. Park*, H. Lee*

Ultralow-overpotential acidic oxygen evolution reaction over bismuth telluride-carbon nanotube heterostructure with organic framework, Small 20 (2024) 2307059 (IF 13.3, JCR top 6.6%)

[51] S. Lee, Y. Kim, G. Geum, S. Kang, D.H. Shin, S.H. Lee, J. Lee, H. Lee

Thermal performance analysis of heat pipe heat exchanger using porous media modeling, Trans. Korean Soc. Mech. Eng. B 47 (12) (2023) 689-696

[50] W. Sung, J. Kim, T.T. Giang, K.S. Jang, J. Kim, D-H. Kim, H. Lee*, J. Ryu*

Parametric study of a projectile launched by a compressed air cannon, Journal of Mechanical Science and Technology 37 (2023), 5913-5933

[49] R. D. Selvakumar, DA. K. Alkaabi, J. Ryu*, H. Lee*

Role of dielectric force and solid-extraction in electrohydrodynamic flow assisted melting, Journal of Energy Storage 69 (2023) 109169 (IF 9.4, JCR top 16.1%)

[48] . H. Ahn, J. Kim, S. R. Lee, U. D. Lee, S. Kim, D. Shin, H. Lee*, J. Ryu*

Experimental analysis of biomimetic silencer to reduce exhaust noise in pneumatic devices, Applied Acoustics 214 (2023) 109681 (IF: 3.4, JCR top : 21%)

[47] Y. Jeong, S. I. Baek, D-T Vo, S. Kim, D. Kim, H. Lee*, J. Ryu*

Combined effect of blowing ratio and mist diameter with mainstream turbulence intensity in mist-assisted film cooling, Engineering Applications of Computational Fluid Mechanics 17 (2023) 2253296 (IF: 6.1, JCR Top: 8.4%)

[46] S. Cho, D. Kong, G. Geum, S. Kang, J. H. Seo, J. S. Kim, S. H. Lee, J. Lee, H. Lee*

Experimental and computational investigation of thermal performance and fluid flow in two-phase closed thermosyphon, Applied Thermal Engineering 235 (2023) 121327 (IF 6.4, JCR top 6.2%)

[45] R. D. Selvakumar, D. Kong, H. K. Lee, C. R. Kharangate, J. Ryu*, H. Lee*

Enhanced heat transfer in a microchannel with pseudo-roughness induced by Onsager-Wien effect, Applied Thermal Engineering 233 (2023) 121122 (IF 6.4, JCR top 6.2%)

[44] H. Lee, K. Kim, D. Kong, M.H. Ahn, D. Lee, H. Jun, C. R. Kharangate, J. Ryu*, H. Lee*

Dynamic artificial neural network model for ultra-low temperature prediction in hydrogen storage tank, Journal of Energy Storage 69 (2023) 107866 (IF 9.4, JCR top 16.1%)

[43] T.T.G. Le, J. Kim, G.-D. Park, W. Sung, M. Cho, H. Lee*, J. Ryu*

Effect of curvature radius and angle on aerodynamic characteristics of a sphere travelling in a branched tube system, Engineering Applications of Computational Fluid Mechanics 17 (2023) 2208633 (IF 6.519, JCR top 6.2%)

[42] R. D. Selvakumar, H. Lee*

Thermal boundary layer depletion in minichannels by electrohydrodynamic conduction pumping, Applied Thermal Engineering 230 (2023) 120758 (IF 6.465. JCR top 6.93%)

[41] D. Kong, E. Jung, Y. Kim, V. V. Manepalli, K. J. Rah, H.S. Kim, Y. Hong, H. G. Choi, D. Agonafer, H. Lee*,

An additively manufactured manifold-microchannel heat sink for high-heat flux cooling, Int. J. Mechanical Sciences 248 (2023) 108228 (IF 6.772, JCR top 4.71%)

[40] Y. Qiu, T. Vo, D. Grag, H. Lee, C.R. Kharangate

A systematic approach to optimization of ANN model parameters to predict flow boiling heat transfer coefficient in mini/micro-channel heatsinks, Int. J. Heat Mass Transfer 202 (2023) 123728 (IF 5.584, JCR top 6.3%)

[39] H. Lee, H. Lee, H. Jun, C. Jeong, D. Lee, S.W. Kim

Numerical investigation of heat exchanger performance for cryogenic chamber to evaluate the safety of hydrogen components, Trans. Korean Soc. Mech. Eng. B 46 (4) (2022) 187-193

[38] H. Zhou, J. Lee, M. Kang, H. Kim, H. Lee*, J.B. In*

All laser-based fabrication of microchannel heat sink, Materials & Design (2022) 110968. (IF 9.417, JCR top 16.67%)

[37] K. Kim, H. Lee, M. Kang, G. Lee, K. Jung, C. R. Kharangate, M. Asheghi, K. E. Goodson, H. Lee*

A machine learning approach for predicting heat transfer characteristics in micro-pin fin heat sinks, Int. J. Heat Mass Transfer 194 (2022) 123087. (IF 5.584, JCR top 6.3%)

[36] T. Kim, S. I. Park, C. Song, H. Lee, J. Cho

Fundamental conduction cooling limits for sub-1 μm Ga2O3 devices integrated with diamond, Int. J. Heat Mass Transfer 191 (2022) 122864. (IF 5.584, JCR top 6.3%)

[35] R. D. Selvakumar, H. Lee*

Bouncing modes and heat transfer of a dielectric droplet in the presence of an external electric field, Int. J. Heat Mass Transfer 191 (2022) 122837. (IF 5.584, JCR top 6.3%)

[34] E. Cho#, H. Lee#, D. Jung, M. Kang, G. Lee, S. Lee, C.R. Kharangate, H. Ha, S. Huh, H. Lee*

A neural network model for free-falling condensation heat transfer in the presence of non-condensable gases, Int. J.Thermal Science (2022) 107202 (IF 3.744, JCR top 22.93%)

[33] C.H. Jeong, H.J. Lee, C.K. Choi, H. Lee, S.H. Lee

Development of the real-time concentration measurement method for evaporating binary mixture droplet using surface plasmon resonance imaging, Journal of ILASS-Korea 26 (4) (2021) 212-218

[32] D. Kong#, Y. Kim#, M. Kang, E. Song, Y. Hong, H.S. Kim, K. J. Rah, H. G. Choi, D. Agonafer, H. Lee*,

A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling, Case Studies in Thermal Engineering (2021) 101583 (IF 4.724, JCR top 10.83%)

[31] K. Guye, D. Dong, Y. Kim, H. Lee, D. Agonafer*

Guidelines for designing micropillar structures for enhanced evaporative heat transfer, Journal of Electronic Packaging 143 (2021) 107202 (IF 1.843, JCR top 64.29%)

[30] H. Lee#, M. Kang#, K.W. Jung, C.R. Kharangate, S. Lee, M. Iyengar, C. Malone, M. Asheghi, K.E.Goodson, H. Lee*

An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sinks, Applied Thermal Engineering 194 (2021) 117012 (IF 4.725, JCR top 9.0%)

[29] D. Jung, H. Lee, D. Kong, E. Cho, K.W. Jung, C.R. Kharangate, M. Iyengar, C. Malone, M. Asheghi, K.E.Goodson, H. Lee*

Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits, Int. J. Heat Mass Transfer 175 (2021) 121192. (IF 4.947, JCR top 7.0%)

[28] G. Shin, H. Yong, J. Chung, E. Cho, J. Ju, Z.H. Lin, D. Kim, H. Lee, B. Koo*, S. Lee*

Condensed droplet-based electricity generation via water-phase change, Nano Energy 82, (2021) 105713. (IF 16.602, JCR top 4.8%)

[27] Y. Qiu, H. Lee, C.R. Kharangate*

Computational investigation of annular flow condensation in microgravity with two-phase inlet conditions, Int. Comm. Heat Mass Transfer 118 (2020) 104877. (IF 4.127, JCR top 7.1%)

[26] Y. Kim#, S. Jung#, S. Kim, S. T. Choi, M. Kim*, H. Lee*

Heat transfer performance of water-based electrospray cooling, Int. Comm. Heat Mass Transfer118 (2020) 104861. (IF 4.127, JCR top 7.1%)

[25] D. Kong, M. Kang, K.Y. Kim, J. Jang, J. Cho, J.B. In*, H. Lee*,

Hierarchically structured laser-induced graphene for enhanced boiling on flexible substrates, ACS Appl. Mater. Interfaces 12 (2020) 37784-37792. (IF 8.456, JCR top 9.0%)

[24] K.W. Jung, E. Cho, H. Lee, C.R. Kharangate, F. Zhou, M. Asheghi, E.M. Dede, K.E. Goodson

Thermal and manufacturing design considerations for silicon-based embedded microchannel-3d manifold coolers (EMMCs): Part 1 – Experimental study of single-phase cooling performance with R-245fa, J. Electronic Packaging 142 (2020) 031117. (IF 1.990, JCR top 46.9%)

[23] J. Kim, J. Yeom, D. Kong, H. Lee*, S.M. Kim*

Analysis of the enhancing mechanism in pool boiling heat transfer through wetting speed for rough aluminum surfaces with FC-72, Int. J. Heat Mass Transfer 150 (2020) 119325. (IF 4.947, JCR top 5.6%)

[22] C.R. Kharangate*, W. Libeer, J. Palko, H. Lee, J. Shi, J. Maulbetsch, M. Asheghi, K.E. Goodson

Investigation of 3D manifold architecture heat sinks in air-cooled condensers, Applied Thermal Engineering 167 (2020) 114700. (IF 4.725, JCR top 9.0%)

[21] D. Kong#, K.W. Jung#, S. Jung, D. Jung, J. Schaadt, M. Iyengar, C. Malone, C. R. Kharangate, M. Asheghi, K.E. Goodson, H. Lee*

Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa, Int. J. Heat Mass Transfer 141 (2019) 145-155. (IF 4.947, JCR top 5.6%)

[20] C. Song, H. Lee, J. Cho*

Fundamental limits for near-junction conduction cooling of high power GaN-on-diamond devices, Solid State Communications 295 (2019) 12-15. (IF 1.549)

[19] K.W. Jung, C.R. Kharangate, H. Lee, J. Palko, F. Zhou, M. Asheghi, E.M. Dede, K.E. Goodson*

Embedded cooling with 3D manifold for vehicle power electronics application: single-phase thermal-fluid performance, Int. J. Heat Mass Transfer 130 (2019) 1108-1119. (IF 4.947, JCR top 5.6%)

[18] H. Lee*, T. Maitra, J.W. Palko, D. Kong, C. Zhang, M.T. Barako, Y. Won, M. Asheghi, K.E. Goodson

Enhanced heat transfer using microporous copper inverse opals, J. Electronic Packaging 140 (2018) 020906. (IF 2.210, JCR top 31.7%)

[17] C.R. Kharangate, K. W. Jung, S. Jung, D. Kong, J. Schaadt, M. Iyengar, C. G Malone, H. Lee, M. Asheghi, K.E. Goodson*

Experimental investigation of embedded micro-pin-fins for single-phase heat transfer and pressure drop, J. Electronic Packaging 140 (2018) 021001. (IF 2.210, JCR top 31.7%)

[16] K. Montazeri, H. Lee, Y. Won*

Microscopic analysis of thin film evaporation on spherical pore surfaces, Int. J. Heat Mass Transfer 122 (2018) 59-68. (IF 4.947, JCR top 5.6%)

[15] H. Lee*, D. D. Agonafer*, K.W. Jung, P. A. Vasquez, S. Lingamneni, J. W. Palko, T. Maitra, Y. Won, K. E. Goodson

Porous micropillar structures for retaining low surface tension liquids, Journal of Colloid & Interface Science 514 (2018) 316-327. (IF 7.489, JCR top 19.1%)

[14] J. W. Palko, H. Lee, C. Zhang, T. J. Dusseault, T. Maitra, Y. Won, D. D. Agonafer, J. Moss, F. Houshmand, G. Rong, J. D. Wilbur, D. Rockosi, I. Mykyta, D. Resler, D. Altman, M. Asheghi, J. G. Santiago, K. E. Goodson*

Extreme convective boiling from template-fabricated microporous copper on laser-etched diamond, Adv. Funct. Mater. (2017) 1703265. (IF 16.836, JCR top 4.0%)

[13] H. Lee*, D. D. Agonafer*, Y. Won, F. Houshmand, C. Gorle, M. Asheghi, K.E. Goodson

Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices, J. electronic packaging 138 (2016) 010907

[12] C.R. Kharangate, H. Lee, Ilchung Park, I. Mudawar*,

Experimental and computational investigation of vertical upflow condensation in a circular tube, Int. J. Heat Mass Transfer 95 (2016) 249-263

[11] H. Lee, C.R. Kharangate, N. Mascarenhas, Ilchung Park, I. Mudawar*

Experimental and computational investigation of vertical downflow condensation, Int. J. Heat Mass Transfer 85 (2015) 865 – 879

[10] N. Mascarenhas, H. Lee, I. Mudawar*

Experimental and computational investigation of interfacial shear along a wavy two-phase interface, Int. J. Heat Mass Transfer 85 (2015) 265-280

[9] C. Konishi, H. Lee, I. Mudawar*, M. M. Hasan, H. K. Nahra, N. R. Hall, J. D. Wagner, R. I. May, J. R. Juergens, J. R. Mackey

Flow boiling in microgravity: part 2 – critical heat flux interfacial behavior, experimental data, and model, Int. J. Heat Mass Transfer 81 (2015) 721-736

[8] C. Konishi, H. Lee, I. Mudawar, M. M. Hasan, H. K. Nahra, N. R. Hall, J. D. Wagner, R. I. May, J. R. Juergens, J. R. Mackey

Flow boiling in microgravity: part 1 – interfacial behavior and experimental heat transfer results, Int. J. Heat Mass Transfer 81 (2015) 705-720

[7] C. R. Charangate, H. Lee, I. Mudawar*

Computational modeling of turbulent evaporating falling films, Int. J. Heat Mass Transfer 81 (2015) 52-62

[6] I. Park, H. Lee, I. Mudawar*

Determination of flow regimes and heat transfer coefficient for condensation in horizontal tubes, Int. J. Heat Mass Transfer 80 (2015) 698-716

[5] H. Lee, I. Park, I. Mudawar*, M.M. Hasan

Micro-channel evaporator for space applications – 2. assessment of predictive tools, Int. J. Heat Mass Transfer 77 (2014) 1231-1249

[4] H. Lee, I. Park, I. Mudawar*, M.M. Hasan

Micro-channel evaporator for space applications – 1. experimental pressure drop and heat transfer results for different orientations in Earth’s gravity, Int. J. Heat Mass Transfer 77 (2014) 1213-1230

[3] H. Lee, I. Park, C. Konishi, I. Mudawar*, R. I. May, J. R. Juergens, J. D. Wagner, N. R. Hall, H. K. Nahra, M. M. Hasan, J. R. Mackey

Experimental investigation of flow condensation in microgravity, J. Heat Transfer 136 (2014) 021502.

[2] H. Lee, I. Mudawar*, M. M. Hasan

Flow condensation in horizontal tubes, Int. J. Heat Mass Transfer 66 (2013) 31-45

[1] H. Lee, I. Mudawar*, M. M. Hasan

Experimental and theoretical investigation of annular flow condensation in microgravity, Int. J. Heat Mass Transfer 61 (2013) 293-309