We study heat transfer, aiming to combine fundamental physics of micro and nanoscale heat and mass transport processes with novel surfaces & materials to provide creative solutions in thermal management. We focus on electronic packaging, microfluidic heat sink, and energy conversion devices for flexible electronics, data centers, and high power electronic systems

Featured articles 

Kong et al., Boiling-induced thermal degradation of copper inverse opals and its mitigation, Int. Comm. Heat Mass Transfer 151 (2024) 107250
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Kim at al., Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap, Applied Thermal Engineering 241 (2024) 122325
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Arbab et al., Ultralow-Overpotential Acidic Oxygen Evolution Reaction Over Bismuth Telluride–Carbon Nanotube Heterostructure with Organic Framework, Small (2023) 2307059
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Kong et al., An additively manufactured manifold-microchannel heat sink for high-heat flux cooling, Int. J.  Mechanical Sciences 248 (2023) 108228
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Kim et al., A machine learning approach for predicting heat transfer characteristics in micro-pin fin heat sinks, Int. J. Heat Mass Transfer 194 (2022) 123087
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