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Welcome

Advanced Thermal Systems Laboratory is directed by Dr. Hyoungsoon Lee at Chung-Ang University. We study heat transfer, aiming to combine fundamental physics of micro and nanoscale heat and mass transport processes with novel surfaces & materials to provide creative solutions in thermal management. We focus on electronic packaging, microfluidic heat sink, and energy conversion devices for flexible electronics, data centers, and high power electronic systems



ATSLA is seeking highly motivated Undergraduate Research Interns, M.S. students, Ph.D. students, and Postdoctoral Researchers to join our research team in 2026.
Students and researchers interested in joining the lab are encouraged to contact Prof. Hyoungsoon Lee(leeh@cau.ac.kr).

About us

ATSLA

Advanced Thermal Systems Lab.

We study heat transfer, aiming to combine fundamental physics of micro and nanoscale heat and mass transport processes with novel surfaces & materials to provide creative solutions in thermal management.

We focus on electronic packaging, microfluidic heat sink, and energy conversion devices for flexible electronics, data centers, and high power electronic systems.

Research

Advanced Thermal Systems Lab

01

Fundamental Studies Of Nano To Macro-Scale Heat And Mass Transport

02

Material Development For Nano To Macro-Scale Heat And Mass Transport

03

Theoretical, AI, And CFD Modeling For Heat Transfer

We Study

We Study Heat And Mass Transfer In Advanced Thermal Systems.

ATSLA aims to combine fundamental physics of micro and nanoscale heat and mass transport processes with novel surfaces & materials to provide innovative solutions in thermal management.

Research Topics

Our research focuses on electronic packaging, microfluidic heat sinks, and energy conversion devices for applications in flexible electronics, data centers, and unmanned aerial vehicle systems.

01. Fundamental Studies Of Nano To Macro-Scale Heat And Mass Transport
02. Material Development For Nano To Macro-Scale Heat And Mass Transport
03. Theoretical, AI, And CFD Modeling For Heat Transfer

Featured Articles 

Advanced Thermal Systems Lab

Kong et al., Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels, Energy Conversion and Management 315 (2024) 118809
Kim at al., Functionalized Diamond Heat Spreader for Enhanced Boiling in High-Power Electronics, Applied Thermal Engineering 289 (2026) 129919
Lee et al., Structured Selective Activation for Bubble-Controlled High-Rate Alkaline OER, Small (2026) 
Kong et al., An additively manufactured manifold-microchannel heat sink for high-heat flux cooling, Int. J.  Mechanical Sciences 248 (2023) 108228
Lee et al., Physics-informed machine learning for enhanced prediction of condensation heat transfer, Energy and AI  20 (2025) 100482

We are always looking for

bright, energetic, motivated graduate and undergraduate students, postdocs, and visiting scholars to join our team.

ATSLA News

ATSLA members at the 2026 Summer Workshop in Daebudo, sharing research and enjoying futsal, swimming and games

ATSLA 2026 Summer Workshop

ATSLA held its 2026 Summer Workshop at Blanc Emere[…]

ATSLA members Hyoungsoon Lee, Soeun Lee and Jonghyun Lee at the ASME 2026 Summer Heat Transfer Conference in Bellevue, with poster presentations

ATSLA at the ASME 2026 Summer Heat Transfer Conference (S…

Prof. Hyoungsoon Lee, Soeun Lee, and Jonghyun Lee attended[…]

Soeun Lee receiving the Excellent Paper Award at 14NCFE 2026 with ATSLA members at the conference

ATSLA at 14NCFE 2026; Soeun Lee Wins Excellent Paper Award

ATSLA members attended the 14th National Congress on Fluids[…]