[74] Y. Kim, K. Kim, J. Park, Y. Lee, H. Lee*,

실리콘 표면의 비등핵 조절을 이용한 임계열유속 향상, 2023 대한기계학회 추계학술대회, 송도, 2023.11.1~4.

[73] J. Park, Y. Kim, K. Kim, Y. Lee, H. Lee*,

레이저 에칭을 이용한 마이크로-핀 핀의 향상된 풀비등 열전달, 2023 대한기계학회 추계학술대회, 송도, 2023.11.1~4.

[72] K. Kang, G. Geum, H. Lee*, C. Han, D. Shin,

노즐젯 핀-휜 냉각기 성능 개선을 위한 unit cell 해석, 2023 대한기계학회 추계학술대회, 송도, 2023.11.1~4.

[71] K. Kim, Y. Kim, J. Park, Y. Lee, H. Lee*,

다공성 구리 표면에서의 레이저 조사를 통한 비등 핵 생성 및 액체-증기 분리를 이용한 풀 비등 열 전달 향상, 2023 대한기계학회 추계학술대회, 송도, 2023.11.1~4.

[70] ED. Kong, H. Kwon, R. Giglio, M. Shattique, C. Zhang, J. Palko, M. Asheghi, K.E. Goodson*, H. Lee*,

Enhanced Boiling Heat Transfer on a Capillary-driven Microcooler, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San diego, CA, Oct 24- Oct 26, 2023.

[69] E. Jung, M. Kang, J. Park, D. Kong, K. Kim, H. Jung, H. Ahn, H. Kim, H. Lee*,

Au, Ag Inverse Opals for Improved Cooling Performance in GaN HEMTs RF Amplifier, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San diego, CA, Oct 24- Oct 26, 2023.

[68] D. Kong, H. Kwon, R. Giglio, M. Shattique, C. Zhang, J. Palko, M. Asheghi, K.E. Goodson*, H. Lee*,

다공성 모델을 이용한 히트파이트 열교환기의 열 성능 해석, 2023 한국유체기계학회 하계학술대회, 평창, 2023.7.5~7.

[67] S. Lee, Y. Kim, G. Geum, S.Kang, D.Shin, S.Lee, J.Lee, H.Lee,

Prediction of Geometrical Effects on Thermal-hydraulic Performance of Boiling Pipe Exchanger using Porous Media model, 대한기계학회 열공학부문 2023년 춘계학술대회, 부산, 2023.4.19~21.

[66] M. Kang, J. Park, H. Jung, H. Ahn, S. Kim, J. Lim, H. Kim, H. Lee,

GaN HEMT RF Power Amplifier의 직접냉각, 대한기계학회 열공학부문 2023년 춘계학술대회, 부산, 2023.4.19~21.

[65] S. Cho, M. Kang, J. Park, D. Kong, K. Kim, Y. Kim, H. Jung, H. Ahn, S. Kim, J. Lim, H. Kim, H. Lee,

고발열 소자 냉각을 위한 다공성 다이아몬드 표면을 가진 임베디드 제트 충돌 마이크로 핀-휜의 열유동 특성 평가, 대한기계학회 열공학부문 2023년 춘계학술대회, 부산, 2023.4.19~21.

[64] K. Kim, D. Kong, H. Lee,

Reliability of CIO heat transfer in relation to the size effect, 대한기계학회 열공학부문 2023년 춘계학술대회, 부산, 2023.4.19~21.

[63] J. Park, M. Kang, H. Jung, H. Ahn, S. Kim, J. Lim, H. Kim, H. Lee,

GaN HEMT RF 소자의 열관리를 위한 매니폴드 마이크로 채널 히트싱크 구조의 열 및 유동 특성 분석, 대한기계학회 열공학부문 2023년 춘계학술대회, 부산, 2023.4.19~21.

[62] Y. Lee, D. Kong, H. Lee,

레이저 직접 조사를 이용한 모세관 공급 이중 증발기에 관한 연구, 대한기계학회 열공학부문 2023년 춘계학술대회, 부산, 2023.4.19~21.

[61] H. Kim. H. Lee, J. B. In,

Transient electrothermal technique을 이용한 금속 마이크로 와이어의 열확산도 측정, 대한기계학회 2022년 학술대회, 제주, 2022.11.9~12.

[60] G. Geum, S. Cho, D. Kong, S. H. Lee, J. Lee, H. Lee*,

다공성 모델을 이용한 히트파이프 열교환기의 열 성능 해석, 한국유체기계학회 2022년 학술대회, 제주, 2022.11.30~12.2.

[59] E. Jung, D. Kong, J. Kim, J. Jung, J. B. In, K. Oh, H. Lee*,

레이저 유도 그래핀을 이용한 배터리의 침지-비등 냉각 성능 향상, 대한기계학회 2022년 추계학술대회, 제주, 2022.11.9~12.

[58] G. Geum, D. Kong, S. Cho, S. H. Lee, J. Lee, H. Lee*,

폐열회수 향상을 위한 히트파이프 열교환기 열 성능 분석, 대한기계학회 2022년 추계학술대회, 제주, 2022.11.9~12.

[57] S. Cho, D. Kong, G. Geum, S. H. Lee, J. Lee, H. Lee*,

2상 밀폐 열사이펀을 위한 응축 물질 전달 강화 계수 자동 선정 및 형상에 따른 열성능 변화 분석, 대한기계학회 2022년 추계학술대회, 제주, 2022.11.9~12.

[56] H. Lee,

고발열 전력반도체 임베디드 냉각 – 유망열공학자 초청세션, 대한기계학회 2022년 추계학술대회, 제주, 2022.11.9~12.

[55]  Y. Kim, D. Kong, J. Lee, B. Jang, H. Kwon, J. B. In, H. Lee*,

Porous Diamond Surface for Enhanced Two-Phase Heat Transfer, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Orange County, CA, Oct 25- Oct 27, 2022.

[54] M. Kang, D. Kong, J. Lee, J. In, H. Lee*,

Evaporative/boiling Wick Cooling Using Laser-Induced Graphene for Flexible Electronics, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Orange County, CA, Oct 25- Oct 27, 2022.

[53] H. Lee, C. Kharangate, H. Lee*,

Multimodal Prediction for Flow Boiling Heat Transfer, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Orange County, CA, Oct 25- Oct 27, 2022.

[52] S. Cho, D. Kong, G. Geum, J. S. Kim, S. H. Lee, J. Lee, H. Lee*,

Numerical Prediction of Visualization and Temperature Distribution of Two-Phase Closed Thermosyphon with OpenFOAM, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Orange County, CA, Oct 25- Oct 27, 2022.

[51] S. Cho, D. Kong, G. Geum, S. H. Lee, J. Lee, H. Lee*,

2상 밀폐 열사이펀의 가시화 및 온도 분포 예측 모델 개발, 한국유체기계학회 하계학술대회, 평창, 22.6.29-7.1

[50] J. Lee, H. Zhou, M. Kang, H. Kim, H. Lee, J. B

In, Rapid and facile micro heatsink fabrication using all-laser process, 대한기계학회 춘계 열공학회, 경주, 22.4.20-22

[49] D. Kong, K. Kim, M. Kang, B. Jang, H. Kwon, H. Lee*,

고발열 (>1kW/cm2) 소자냉각을 위한 구리 역오팔을 가진 임베디드 매니폴드 마이크로채널의 열유동 특성 평가, 대한기계학회 춘계 열공학회, 경주, 22.4.20-22

[48] S. Cho, D. Kong, G. Geum, J. S. Kim, H. Lee*,

S. H. Lee, J. Lee, OpenFOAM을 활용한 2상 밀폐 열사이펀의 가시화 및 온도 분포에 대한 수치적 예측, 대한기계학회 춘계 열공학회, 경주, 22.4.20-22

[47] G. Geum, S. Cho, D. Kong, S. H. Lee, J. Lee, H. Lee*,

H. Jun, C. Jeong, D. Lee, S. W. Kim, 수소부품 안전성 평가를 위한 극저온 챔버용 열교환기 성능해석, Trans. Korean Soc. Mech. Eng. B. 46(4) pp. 187~193(2022)

[46] C.H. Jeong, H. J. Lee, C. K. Choi, H. Lee, S. H. Lee*,

표면플라즈몬공명 가시화 장치를 이용한 증발하는 이종혼합물 액적의 실시간 농도 가시화 기법 개발, 한국분무공학회지 제 26권, 제4호 (2021)

[45] H. Zhou, H. Lee, J. Lee,

C. Ryu. H. Lee, J. B. In, Laser-assisted fabrication of microchannels for the application in boiling heat transfer, 대한기계학회 추계 학술대회, 광주, 21.11.3-6.

[44]  K. Kim, D. Kong, B. Jang, H. Kwon, H. Lee*,

다공성 구리 코팅된 매니폴드 마이크로갭에서의 흐름 비등 열전달 향상, 대한기계학회 추계 학술대회, 광주, 21.11.3-6.

[43] M. Kang, D. Kong, J. Lee, J. In, H. Lee*,

유연한 다공성 레이저 유도 그래핀 윅을 이용한 증발 열전달 향상, 대한기계학회 추계 학술대회, 광주, 21.11.3-6.

[42] H. Choi, Y. Kim, D. Kong, K. Kim, H. Lee*,

다공성 구리표면의 정전분무를 활용한 증발 열전달 향상, 대한기계학회 추계 학술대회, 광주, 21.11.3-6.

[41] H. Lee, K. Kim, M. Kang, H. Lee*,

H. Jeon, C. Jung, K. Ha, D. Baek, S. Kim, 수소용 열교환기 효율 및 온도에 대한 동적 인공지능망 모델 개발, 한국자동차안전학술대회, 여수, 21.10.28-30.

[40] Y. Kim, D. Kong, J. Lee, B. Jang, H. Kwon, J. B. In, H. Lee*,

다공성 다이아몬드 표면에서의 열전달 성능향상,  대한기계학회 춘계 열공학회, 제주 KAL 호텔, 21.5.26-28.

[39] E. Cho, D. Jung, H. Lee, M. Kang, H. Lee*,

인공신경망을 이용한 비응축성 기체 존재시 응축열전달 예측 모델링,  대한기계학회 추계 학술대회, 온라인, 20.12.16-24.

[38] H. Lee, D. Jung, M. Kang, D. Kong, H. Lee*,

마이크로-핀핀 히트싱크의 다상에서의 압력강하 및 열전달 분석,  대한기계학회 추계 학술대회, 온라인, 20.12.16-24.

[37]  D. Baek, H. Jeon, H. Lee, Y. Kim, G. Lee, H. Lee*,

수소 부품 안전성 평가 기술 및 부품 장비 개발, 한국자동차안전학술대회, 20.11.26-28.

[36] D. Jung, D. Kong, E. Cho, K. Jung, M. Iyengar, C. Malone, M. Asheghi, K. E. Goodson, H. Lee*,

Flow boiling heat transfer in embedded micro-pin fin arrays, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Anaheim, CA, Oct 7- Oct 9, 2019.

[35] S. Jung, Y. Kim, S. Kim, M. Kim, H. Lee*,

Enhancement of Heat Transfer in Water-based Electrospray Cooling, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Anaheim, CA, Oct 7- Oct 9, 2019.

[34]  D. Kong, K. Jung, S. Jung, D. Jung, J. Schaadt, M. Lyengar, C. Malone, C. R. Kharangate, M. Asheghi, K. E. Goodson, H. Lee*,

Single-phase thermal and hydraulic performance of embedded micro-pin fins, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Anaheim, CA, Oct 7 – Oct 9, 2019.

[33]  D. Jung, D. Kong, M. Kang, H. Lee, and H. Lee*,

Thermal and hydraulic analysis in embedded micro-pin fin arrays for high performance 3D ICs, 대한기계학회 춘계 열공학회, 부산, 19.5.22-24.

[32]  Y. Kim, S. Jung, E. Cho, S. Kim, M. Kim, H. Lee,

Electrospray for enhanced evaporative cooling,대한기계학회 춘계 열공학회, 부산, 19.5.22-24.

[31]  D. Kong, M. Kang, K. Y. Kim, J. B. In, H. Lee*,

Embedded microfluidic pin-fin heat sink for 3D ICs, 대한기계학회 춘계 열공학회, 부산, 19.5.22-24.

Embedded microfluidic pin-fin arrays for high performance 3D ICs, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug 28 – Aug 30, 2018.

[29] D. Kong, T. X. Tran, J. B. In, H. Lee*,

Direct laser writing for enhanced boiling on flexible surfaces, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug 28 – Aug 30, 2018

[28]  D. Kong*, D. Jung, Y. Kim, E Cho, S. Jung, H. Lee,

Embedded microfluidic pin-fin heat sink for 3D ICs, 대한기계학회 춘계 열공학회, 제주, 18.4.26-27 – BEST POSTER AWARD

Advanced Cooling Solutions for 2D & 3D Chips with Extreme Power Densities, 10th Workshop on Thermal Solutions for IT Electronics, Sep 8, 2017

[26] K. W. Jung, M. Asheghi, K. E. Goodson, C. Kharangate, J. Palko, H. Lee,

F. Zhou, E. M. Dede, Thermofluidic Characterization of An Embedded Microchannel-3D Manifold Cooling Module for High Heat Flux(1kW/cm²) Power Electronics Application, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug 29 – Sep 1, 2017

[25] C. Kharangate, K.W. Jung, M. Asheghi, K. E. Goodson, H. Lee,

Experimental Study of Single/Two-phase Heat Transfer for 3D-Chip Embedded Cooling with Micro Pin-fin Arrays, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug 29 – Sep 1, 2017

[24] K. Montazeri, H. Lee,

Y. Won, Thin Film Evaporation Within Spherical Pores for Electronics Cooling, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug 29 – Sep 1, 2017 – BEST POSTER AWARD

[23] D. Kong, H. Lee*,

Thermal performance evaluation and design optimization of full geometries of manifold microchannel heat sinks, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug 29 – Sep 1, 2017

[22] E. Cho, S. Jung, J. Palko, J. W. Palko, M. Asheghi, K. E. Goodson, H. Lee*,

Comprehensive Modeling of Single Bubble Evaporation in Microchannel, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug 29 – Sep 1, 2017

[21] K. W. Jung, C. Kharangate, J. Palko, M. Asheghi, K. E. Goodson, H. Lee,

F. Zhou, E. M. Dede, Overcoming Chanllenges in Microfabrication of Si and SiC-based Embedded Microchannel-3D Manifold Cooling Module for High Heat Flux(1kW/cm²) Power Electronics Application, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug 29 – Sep 1, 2017

[20] H. Lee*,

T. Maitra, J. W. Palko, C. Zhang, M. T. Barako, M. Asheghi, K. E. Goodson, Enhanced boiling performance in hierarchical bi-porous surfaces, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug 29 – Sep 1, 2017

[19] H. Lee*,

T. Maitra, J. W. Palko, C. Zhang, M. T. Barako, M. Asheghi, K. E. Goodson, Copper inverse opal surfaces for enhanced boiling heat transfer, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug 29 – Sep 1, 2017

[18] K. W. Jung*,

C. R. Kharangate, J. Palko, M. Asheghi, K. E. Goodson, H. Lee, F. Zhou, E. M. Dede, Microchannel Cooling Strategies for High Heat Flux (1kW/cm²) Power Electronic Applications, The Intersociety Conference on Thermal and Thermomechanical phenomena in Electronic Systems, Orlando, FL, May 30- June 2, 2017

[17]  C. R. Kharangate, T. Liu, K. W. Jung, H. Lee*,

M. Asheghi, K. E. Goodson, Thermal Modeling of Single-phase and Two-phase 2D-chip Cooling using Microchannels, The Intersociety Conference on Thermal and Thermomechanical phenomena in Electronic Systems, Orlando, FL, May 30- June 2, 2017

H. Lee, D. D. Agonafer, C. Zhang, K. W. Jung, M. Barako, F. Houshmand, G. Rong, C. Gorle, Y. Won, M. Asheghi, J. G. Santiago, K. E. Goodson, High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply. The Intersociety Conference on Thermal and Thermomechanical phenomena in Electronic Systems, Las Vegas, NV, May 31- June 3, 2016

Inductive coupled plasma etching of high aspect ratio silicon carbide microchannles for localized cooling, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, July 6-9, 2015

F. Houshmand, H. Lee, T. Liu, Y. Won, M. Asheghi, K. E. Goodson, Validation study for VOF simulations of boiling in a micro-channel, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, July 6-9, 2015.

T. Liu, Y. Won, H. Kazemi, M. Asheghi, K. E. Goodson, Numerical Simulation of advanced monolithic microcooler designs for high heat flux microelectronics, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, July 6-9, 2015.

Y. Won, H. Kazemi, M. Asheghi, K. E. Goodson, Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density GaN-SiC chip, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, July 6-9, 2015.

M. Asheghi, K. E. Goodson, Subcooled Flow Boiling of Methanol in Microtubes, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, July 6-9, 2015.

Y. Won, F. Houshmand, M. Asheghi, K. E. Goodson, Computational Modeling of Extreme Heat Flux Microcooler for GaN-based HEMT, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, July 6-9, 2015. – BEST PAPER AWARD

J. Wilbur, C. Zhang, T. Dusseault, Y. Won, H. Lee, M. Barako,F. Houshmand, D. Agonafer, K.W. Jung, M. Asheghi, J. G. Santiago, K. E. Goodson, Capillary Fed Two Phase Cooling beyond 1 kW/cm² in Short Wicking Length, Joule-Heated, Microporous Copper Layers, 9^th International Conference on Boiling and Condensation Heat Transfer, Boulder CO, April 26-30, 2015. – BEST POSTER AWARD

H. Lee, K. W. Jung, C. Zhang, F. Houshmand, J. Palko, M. Asheghi, K. E. Goodson, Temperature Dependent Wettability of Copper Inverse Opals, 9^th International Conference on Boiling and Condensation Heat Transfer, Boulder CO, April 26-30, 2015.

M. Asheghi, F. Houshmand, H. Lee, S. Scholl, K. E. Goodson, W. Stacy, M. Crawford, R. Danchi, K. Vanhille, Chandelier Interconnects for Electro-Fluidic (ChIEF) Next-Generation RF Amplifiers, Government Microcircuit applications & Critical Technology Conference, St. Louis MO, March 23-25, 2015.

H Lee, C. Konishi, M. M. Hasan, H. K. Nahra, N. R. Hall, J. D. Wagner, R. L. May, J. R. Mackey; Flow Boiling and Condensation Experiment (FBCE) for the International Space Station, American Society for Gravitational and Space Research (ASGSR) 30th Annual Meeting, Pasadena, CA, October 23-26, 2014.

M.M. Hasan, N.R. Hall, J.R. Mackey, J.D. Wagner, R.L. May, R.L. Butcher, J.S. Kolacz, R. Balasubramanian, H. Lee, C. Konishi, I. Mudawar, Flow boiling critical heat flux measurements in reduced gravity, 9th International Conference on Two-Phase Systems for Space and Ground Applications, Baltimore, MD, September 22-26, 2014

N.R. Hall, M.M. Hasan, J.D. Wagner, H.K. Nahra, R.L. May, R.L. Butcher, J.S. Kolacz, H. Lee, C. Konishi, I. Mudawar, High-Speed Imaging System for Two-phase flow research on the international space station, 9th International Conference on Two-Phase Systems for Space and Ground Applications, Baltimore, MD, September 22-26, 2014.