[64] T. D. Mai, D-T Vo, B. Kim, U. Lee, D. Kim, H. Lee*, J. Ryu*,

Impact of Trailing-Edge Modification in Stator Vanes on Heat Transfer and the Performance of Gas Turbine: A Computational Study,  Engineering Applications of Computational Fluid Mechanics, 18 (1), 2393430 (2024) (IF 5.9, JCR Top: 6.2%)

[63] H. Kim. E. Jung, C. Ryu, H. Lee*, J. B. In*,

Nanosecond laser structuring for enhanced pool boiling performance of SiC surfaces, Applied Surface Science 675 (2024) (IF 6.3, JCR top 10.9%)

[62] S. Cho, D. Kong, G. Geum, S. Lee, H. Choi, S. H. Lee, J. Lee*,

H. Lee*, Explicitly defined empirical constant for phase change simulation in a two-phase closed thermocyphon, International Communications in Heat Mass Transfer 158 (2024) 107932  (IF 7.0, JCR top 4.7%)

[61] D. Kong, H. Kwon, B. Hang, H-J. Kwon, M. Asheghi, K. E. Goodson, H. Lee*,

Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels, Energy Conversion and Management 315 (2024) 118809 (IF 9.9, JCR top 1.8%)

[60] H. Kwon, Q. Wu, D. Kong, S. Hazra, K. Jiang, S. Narumanchi, H. Lee, H. Palko, E. M. Dede, M. Asheghi, K. E. Goodson*,

Capillary-enhanced two-phase micro-cooler using copper-inverse-opal wick with silicon microchannel manifold for high-heat-flux cooling application, International Communications in Heat and Mass Transfer 156, 107592 (2024) (IF 7.0, JCR Top: 6%)

[59] E. Jung, D. Kong, M. Kang, J-H Kim, J. H. Jeong, J. B. In, K-Y Oh*, H. Lee*,

Enhanced immersion cooling using laser-induced graphene for Li-ion battery thermal management, International Communications in Heat Mass Transfer 155 (2024) 107558  (IF 7.0, JCR top 4.7%)

[58] N. Her, S-Y Park, S. Woo. H. Lee*, S. T. Choi*,

Viscoelastic finite element analysis of roll transfer process with rate-dependent adhesion behavior and multi-element cohesive interaction, Journal of Mechanical Science and Technology 38 (2024)

[57] C. Ryu, H. Kim, H. Lee, J. B. In*

Laser-induced selective gettability transition of 6061 aluminum alloy surfaces, Journal of Mechanical Science and Technology 38 (2024)

[56] A.M. Randriambololona, V. Manepalli, R. C. MaAfee, B. Ojha, R. Miraftab-Salo, K. Guye, H. Lee, S. Graham, D. Agonafer

3-Component composite phase change material (PCM) for electronics subject to transient/pulsed heat loads, IEEE Transactions on Components, Packaging and Manufacturing Technology (2024)

[55] H. Lee, G. Lee, K. Kim, H. Lee*,

Multimodal machine learning for predicting heat transfer characteristics in micro-pin fin heat sinks, Case Studies in Thermal Engineering 57 (2024) 104331 (IF 6.8, JCR top 7.1%)

[54] K. Kim, D. Kong, Y. Kim, B. Jang, H. J. Kwon, J. Cho, H. Lee*,

Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap, Applied Thermal Engineering 241 (2024) 122325 (IF 6.4, JCR top 6.2%)

[53] B. Kim, T-D Mai, D-T Vo, H.K. Lee, Y. Jeong, S. Chang, H. Lee*, J. Ryu*,

Hydrogen combustion in 2-stage high-pressure gas turbine – thermal and flow simulations for performance comparison with fossil fuels, International Journal of Engine Research 25 (2024)

[52] M. Kang, D. Kong, J. Park, J. B. In, H. Lee*,

Enhanced wick-based liquid supply in patterned laser-induced graphene on flexible substrates, Journal of Mechanical Science and Technology 37 (2024) 1007-1014.

[51] D. Kong, E. Jung, K. Kim, K. Jiang, Q. Wu, B. Jang, H. J. Kwon, M. Asheghi, K. E. Goodson, H. Lee*,

Boiling-induced thermal degradation of copper inverse opals and its mitigation, International Communications in Heat Mass Transfer 151 (2024) 107250  (IF 7.0, JCR top 4.7%)

[50] G. Geum, S. Kang, S. Cho, D. Kong, S. Lee, J-H. Seo, D. H. Shin, S. Lee, J. Lee*, H. Lee*,

Thermal performance analysis of heat pipe heat exchanger for effective waste heat recovery, International Communications in Heat Mass Transfer 151 (2024) 107223  (IF 7.0, JCR top 4.7%)

[49] A.A. Arbab, S. Cho, E. Jung, H. S. Han, S. Park*, H. Lee*,

Ultralow-overpotential acidic oxygen evolution reaction over bismuth telluride-carbon nanotube heterostructure with organic framework, Small 20 (2024) 2307059 (IF 13.3, JCR top 6.6%)

[48] W. Sung, J. Kim, T.T. Giang, K.S. Jang, J. Kim, D-H. Kim, H. Lee*, J. Ryu*,

Parametric study of a projectile launched by a compressed air cannon, Journal of Mechanical Science and Technology 37 (2023), 5913-5933

[47] R. D. Selvakumar, DA. K. Alkaabi, J. Ryu*, H. Lee*,

ole of dielectric force and solid-extraction in electrohydrodynamic flow assisted melting, Journal of Energy Storage  69 (2023) 109169 (IF 9.4, JCR top 16.1%)

[46] . H. Ahn, J. Kim, S. R. Lee, U. D. Lee, S. Kim, D. Shin, H. Lee*, J. Ryu*,

Experimental analysis of biomimetic silencer to reduce exhaust noise in pneumatic devices, Applied Acoustics 214 (2023) 109681 (IF: 3.4, JCR top : 21%)

[45] Y. Jeong, S. I. Baek, D-T Vo, S. Kim, D. Kim, H. Lee*, J. Ryu*,

Combined effect of blowing ratio and mist diameter with mainstream turbulence intensity in mist-assisted film cooling, Engineering Applications of Computational Fluid Mechanics 17 (2023) 2253296  (IF: 6.1, JCR Top: 8.4%)

[44] S. Cho, D. Kong, G. Geum, S. Kang, J. H. Seo, J. S. Kim, S. H. Lee, J. Lee, H. Lee*,

Experimental and computational investigation of thermal performance and fluid flow in two-phase closed thermosyphon, Applied Thermal Engineering 235 (2023) 121327 (IF 6.4, JCR top 6.2%)

[43] R. D. Selvakumar, D. Kong, H. K. Lee, C. R. Kharangate, J. Ryu*, H. Lee*,

Enhanced heat transfer in a microchannel with pseudo-roughness induced by Onsager-Wien effect, Applied Thermal Engineering 233 (2023) 121122 (IF 6.4, JCR top 6.2%)

[42] H. Lee, K. Kim, D. Kong, M.H. Ahn, D. Lee, H. Jun, C. R. Kharangate, J. Ryu*, H. Lee*,

Dynamic artificial neural network model for ultra-low temperature prediction in hydrogen storage tank, Journal of Energy Storage 69 (2023) 107866 (IF 9.4, JCR top 16.1%)

[41] T.T.G. Le, J. Kim, G.-D. Park, W. Sung, M. Cho, H. Lee*, J. Ryu*,

Effect of curvature radius and angle on aerodynamic characteristics of a sphere travelling in a branched tube system, Engineering Applications of Computational Fluid Mechanics 17 (2023) 2208633 (IF 6.519, JCR top 6.2%)

[40] R. D. Selvakumar, H. Lee*,

Thermal boundary layer depletion in minichannels by electrohydrodynamic conduction pumping,  Applied Thermal Engineering 230 (2023) 120758 (IF 6.465. JCR top 6.93%)

[39] D. Kong, E. Jung, Y. Kim, V. V. Manepalli, K. J. Rah, H.S. Kim, Y. Hong, H. G. Choi, D. Agonafer, H. Lee*,

Additively manufactured manifold-microchannel heat sink for high-heat flux cooling, Int. J. Mechanical Sciences 248 (2023) 108228 (IF 6.772, JCR top 4.71%)

[38] Y. Qiu, T. Vo, D. Grag, H. Lee, C.R. Kharangate,

A systematic approach to optimization of ANN model parameters to predict flow boiling heat transfer coefficient in mini/micro-channel heatsinks, Int. J. Heat Mass Transfer 202 (2023) 123728  (IF 5.584, JCR top 6.3%)

[37] H. Zhou, J. Lee, M. Kang, H. Kim, H. Lee*, J.B. In*,

All laser-based fabrication of microchannel heat sink, Materials & Design (2022) 110968. (IF 9.417, JCR top 16.67%)

[36] K. Kim, H. Lee, M. Kang, G. Lee, K. Jung, C. R. Kharangate, M. Asheghi, K. E. Goodson, H. Lee*

A machine learning approach for predicting heat transfer characteristics in micro-pin fin heat sinks, Int. J. Heat Mass Transfer 194 (2022) 123087.  (IF 5.584, JCR top 6.3%)

[35] T. Kim, S. I. Park, C. Song, H. Lee, J. Cho,

Fundamental conduction cooling limits for sub-1 μm Ga₂O₃ devices integrated with diamond, Int. J. Heat Mass Transfer 191 (2022) 122864.  (IF 5.584, JCR top 6.3%)

[34] R. D. Selvakumar, H. Lee*,

Bouncing modes and heat transfer of a dielectric droplet in the presence of an external electric field, Int. J. Heat Mass Transfer 191 (2022) 122837.  (IF 5.584, JCR top 6.3%)

[33] E. Cho^#, H. Lee^#, D. Jung, M. Kang, G. Lee, S. Lee, C.R. Kharangate, H. Ha, S. Huh, H. Lee*,

A neural network model for free-falling condensation heat transfer in the presence of non-condensable gases, Int. J.Thermal Science (2022) 107202 (IF 3.744, JCR top 22.93%)

[32] D. Kong^#, Y. Kim^#, M. Kang, E. Song, Y. Hong, H.S. Kim, K. J. Rah, H. G. Choi, D. Agonafer, H. Lee*,

A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling, Case Studies in Thermal Engineering (2021) 101583 (IF 4.724, JCR top 10.83%)

[31] K. Guye, D. Dong, Y. Kim, H. Lee, D. Agonafer*,

Guidelines for designing micropillar structures for enhanced evaporative heat transfer, Journal of Electronic Packaging 143 (2021) 107202 (IF 1.843, JCR top 64.29%)

[30] H. Lee^#, M. Kang^#, K.W. Jung, C.R. Kharangate, S. Lee, M. Iyengar, C. Malone, M. Asheghi, K.E.Goodson, H. Lee*,

An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sinks, Applied Thermal Engineering 194 (2021) 117012  (IF 4.725, JCR top 9.0%)

[29] D. Jung, H. Lee, D. Kong, E. Cho, K.W. Jung, C.R. Kharangate, M. Iyengar, C. Malone, M. Asheghi, K.E.Goodson, H. Lee*,

Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits, Int. J. Heat Mass Transfer 175 (2021) 121192.  (IF 4.947, JCR top 7.0%)

[28] G. Shin, H. Yong, J. Chung, E. Cho, J. Ju, Z.H. Lin, D. Kim, H. Lee, B. Koo*, S. Lee*,

Condensed droplet-based electricity generation via water-phase change, Nano Energy 82, (2021) 105713. (IF 16.602, JCR top 4.8%)

[27] Y. Qiu, H. Lee, C.R. Kharangate*,

Computational investigation of annular flow condensation in microgravity with two-phase inlet conditions, Int. Comm. Heat Mass Transfer  118 (2020) 104877. (IF 4.127, JCR top 7.1%)

[26] Y. Kim^#, S. Jung^#, S. Kim, S. T. Choi, M. Kim*, H. Lee*,

Heat transfer performance of water-based electrospray cooling, Int. Comm. Heat Mass Transfer118 (2020) 104861. (IF 4.127, JCR top 7.1%)

[25] D. Kong, M. Kang, K.Y. Kim, J. Jang, J. Cho, J.B. In*, H. Lee*,

Hierarchically structured laser-induced graphene on flexible substrates for enhanced boiling heat transfer, ACS Appl. Mater. Interfaces 12 (2020) 37784-37792. (IF 8.456, JCR top 9.0%)

[24]  K.W. Jung, E. Cho, H. Lee, C.R. Kharangate, F. Zhou, M. Asheghi, E.M. Dede, K.E. Goodson,

Thermal and manufacturing design considerations for silicon-based embedded microchannel-3d manifold coolers (EMMCs): Part 1 – Experimental study of single-phase cooling performance with R-245fa, J. Electronic Packaging 142 (2020) 031117. (IF 1.990, JCR top 46.9%)

[23] J. Kim, J. Yeom, D. Kong, H. Lee*, S.M. Kim*,

Analysis of the enhancing mechanism in pool boiling heat transfer through wetting speed for rough aluminum surfaces with FC-72, Int. J. Heat Mass Transfer 150 (2020) 119325. (IF 4.947, JCR top 5.6%)

[22] C.R. Kharangate*, W. Libeer, J. Palko, H. Lee, J. Shi, J. Maulbetsch, M. Asheghi, K.E. Goodson,

Investigation of 3D manifold architecture heat sinks in air-cooled condensers, Applied Thermal Engineering 167 (2020) 114700. (IF 4.725, JCR top 9.0%)

[21] D. Kong^#, K.W. Jung^#, S. Jung, D. Jung, J. Schaadt, M. Iyengar, C. Malone, C. R. Kharangate, M. Asheghi, K.E. Goodson, H. Lee*,

Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa, Int. J. Heat Mass Transfer 141 (2019) 145-155. (IF 4.947, JCR top 5.6%)

[20] C. Song, H. Lee, J. Cho*,

Fundamental limits for near-junction conduction cooling of high power GaN-on-diamond devices, Solid State Communications 295 (2019) 12-15. (IF 1.549)

[19] K.W. Jung, C.R. Kharangate, H. Lee, J. Palko, F. Zhou, M. Asheghi, E.M. Dede, K.E. Goodson*,

Embedded cooling with 3D manifold for vehicle power electronics application: single-phase thermal-fluid performance, Int. J. Heat Mass Transfer 130 (2019) 1108-1119. (IF 4.947, JCR top 5.6%)

[18] H. Lee*, T. Maitra, J.W. Palko, D. Kong, C. Zhang, M.T. Barako, Y. Won, M. Asheghi, K.E. Goodson,

Enhanced heat transfer using microporous copper inverse opals, J. Electronic Packaging 140 (2018) 020906. (IF 2.210, JCR top 31.7%)

[17] C.R. Kharangate, K. W. Jung, S. Jung, D. Kong, J. Schaadt, M. Iyengar, C. G Malone, H. Lee, M. Asheghi, K.E. Goodson*,

Experimental investigation of embedded micro-pin-fins for single-phase heat transfer and pressure drop, J. Electronic Packaging 140 (2018) 021001. (IF 2.210, JCR top 31.7%)

[16] K. Montazeri, H. Lee, Y. Won*,

Microscopic Analysis of Thin Film Evaporation on Spherical Pore Surfaces, Int. J. Heat Mass Transfer 122 (2018) 59-68. (IF 4.947, JCR top 5.6%)

[15] H. Lee*, D. D. Agonafer*, K.W. Jung, P. A. Vasquez, S. Lingamneni, J. W. Palko, T. Maitra, Y. Won, K. E. Goodson,

Porous Micropillar Structures for Retaining Low Surface Tension Liquids, Journal of Colloid & Interface Science 514 (2018) 316-327. (IF 7.489, JCR top 19.1%)

– FEATURED ON COVER ARTICLE

[14] J. W. Palko, H. Lee, C. Zhang, T. J. Dusseault, T. Maitra, Y. Won, D. D. Agonafer, J. Moss, F. Houshmand, G. Rong, J. D. Wilbur, D. Rockosi, I. Mykyta, D. Resler, D. Altman, M. Asheghi, J. G. Santiago, K. E. Goodson*,

Extreme convective boiling from template-fabricated microporous copper on laser-etched diamond, Adv. Funct. Mater. (2017) 1703265. (IF 16.836, JCR top 4.0%)

[13] H. Lee, D. D. Agonafer*, Y. Won, F. Houshmand, C. Gorle, M. Asheghi, K.E. Goodson,

Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices, J. electronic packaging 138 (2016) 010907

[12] C.R. Kharangate, H. Lee, Ilchung Park, I. Mudawar*,

Experimental and computational investigation of vertical upflow condensation in a circular tube, Int. J. Heat Mass Transfer 95 (2016) 249-263

[11] H. Lee, C.R. Kharangate, N. Mascarenhas, Ilchung Park, I. Mudawar*,

Experimental and computational investigation of vertical downflow condensation, Int. J. Heat Mass Transfer 85 (2015) 865 – 879

[10] N. Mascarenhas, H. Lee, I. Mudawar*,

Investigation of influence of fluid dynamics on interfacial shear in adiabatic two-phase flow, Int. J. Heat Mass Transfer 85 (2015) 265-280

[9] C. Konishi, H. Lee, I. Mudawar*, M. M. Hasan, H. K. Nahra, N. R. Hall, J. D. Wagner, R. I. May, J. R. Juergens, J. R. Mackey,

Flow boiling in microgravity: part 2 – critical heat flux interfacial behavior, experimental data, and model, Int. J. Heat Mass Transfer 81 (2015) 721-736

[8] C. Konishi, H. Lee, I. Mudawar, M. M. Hasan, H. K. Nahra, N. R. Hall, J. D. Wagner, R. I. May, J. R. Juergens, J. R. Mackey,

Flow boiling in microgravity: part 1 – interfacial behavior and experimental heat transfer results, Int. J. Heat Mass Transfer 81 (2015) 705-720

[7] C. R. Charangate, H. Lee, I. Mudawar*,

Computational modeling of turbulent evaporating falling films, Int. J. Heat Mass Transfer 81 (2015) 52-62

[6] I. Park, H. Lee, I. Mudawar*,

Determination of flow regimes and heat transfer coefficient for condensation in horizontal tubes, Int. J. Heat Mass Transfer 80 (2015) 698-716

[5] H. Lee, I. Park, I. Mudawar*, M.M. Hasan,

Micro-channel evaporator for space applications – 2. assessment of predictive tools, Int. J. Heat Mass Transfer 77 (2014) 1231-1249

[4] H. Lee, I. Park, I. Mudawar*, M.M. Hasan,

Micro-channel evaporator for space applications – 1. experimental pressure drop and heat transfer results for different orientations in Earth’s gravity, Int. J. Heat Mass Transfer 77 (2014) 1213-1230