We study heat transfer, aiming to combine fundamental physics of micro and nanoscale heat and mass transport processes with novel surfaces & materials to provide creative solutions in thermal management. We focus on electronic packaging, microfluidic heat sink, and energy conversion devices for flexible electronics, data centers, and high power electronic systems

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Palko et al., Extreme convective boiling from template-fabricated microporous copper on laser-etched diamond, Adv. Funct. Mater. 27 (2017)
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Lee, Agonafer et al., Porous Micropillar Structures for Retaining Low Surface Tension Liquids, Journal of Colloid & Interface Science 514 (2018) 316-327 (Featured on front cover)
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Montazeri et al., Microscopic Analysis of Thin Film Evaporation on Spherical Pore Surfaces, Int. J. Heat Mass Transfer 122 (2018) 59-68
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Lee et al., Enhanced heat transfer using microporous copper inverse opals, Journal of Electronics Packaging (2018) in press
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