We study heat transfer, aiming to combine fundamental physics of micro and nanoscale heat and mass transport processes with novel surfaces & materials to provide creative solutions in thermal management. We focus on electronic packaging, microfluidic heat sink, and energy conversion devices for flexible electronics, data centers, and high power electronic systems

Featured articles 

Lee et al., An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sink, Appl. Therm. Eng. 194 (2021)

Kim et al.,  Heat transfer performance of water-based electrospray cooling, Int. Comm. Heat Mass Transfer 118 (2020)
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Kong et al., Hierarchically structured laser-induced graphene on flexible substrates for enhanced boiling heat transfer, ACS Appl. Mater. Interfaces 12 (2020)
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Lee, Agonafer et al., Porous micropillar structures for retaining low surface tension liquids, Journal of Colloid & Interface Science 514 (2018) 316-327 (Featured on front cover)
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Palko et al., Extreme two‐phase cooling from laser‐etched diamond and conformal, template‐fabricated microporous copper, Adv. Funct. Mater. 27 (2017)
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